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Chinese name |
甲基膦酸二甲酯 |
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English name |
Dimethyl Methylphosphonate |
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Molecular formula |
C3H9O3P |
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Synonyms |
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Uses |
Used as an additive flame retardant for epoxy resin as well as in polyurethane foam, unsaturated polyester resin, epoxy resin and other polymer materials. It can also be used as an organic synthesis intermediate, rare metal extraction agent, etc. |
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Properties |
Molecular weight: 124.08 Appearance: Colorless transparent liquid Melting point: t <50 °C Boiling point: 181 °C/0.1005 MPa Density (25 °C): 1.16 ± 0.005 DMMP content: ≥ 99.0% Phosphorus content (theoretical value): 25% |